CTA in Chemie

◇ Fine & Specialty Chemicals: Pharmaceutical Intermediates, Agrochemical Intermediates, Dye Intermediates, Electronic Chemicals, Water Treatment Chemicals, Oilfield Chemicals, Household Products, Paper Chemicals, Textile Chemicals, BioChemical, Custom Synthesis, Catalysts, Rubber and Plastic Assists, Reagent, Surfactants, Food & Feed Additives. ◇ Custom Chemicals ◇ New Materials： Fluoro-Materials, Silicone Materials, Engineering Plastics, Functional Polymer Materials, Nanometer Materials, Membrane Materials, Specialty Fibers,�Fine Ceramics, Photographic Applications. ◇ Chemical Equipments： Pulverization Machinery, Driers, Rectifying Equipments, Sealing Equipments, Analytical & Testing Instruments, Energy Conservation & Environmental Protection Equipments, Packaging, Storage and Transportation.

The largest international exhibition of semiconductor equipment and materials. SEMICON 2010 will feature a pavilion focused on the latest innovations in the semiconductor industry. The ´Next Generation Technology Pavilion´ will consist of five focused exhibit areas that introduce the importance of manufacturing technology that supports emerging markets. - Emerging Technologies – With the theme of nanotechnology, organic semiconductors, and power devices, this exhibit area introduces technologies for which practical application is anticipated, and dramatically progressing technologies in the semiconductor industry from an academic and industry perspective. - LED Technologies – LED lights are used in various light sources for energy saving, recycling, and durability purposes. This exhibit area introduces current trends of the LED industry based on momentum in the market. - MEMS Technology – Technology used in MEMS such as accelerometers and pressure sensors are being more and more adopted in mass produced devices such as automobiles, mobile phones, and handheld electronic devices. This exhibit area introduces a wide range of applications and manufacturing devices related to MEMS technology. - Nanoimprint Technology – Nanoimprint technology is regarded as a next generation lithography method that can bring high resolution and cut down costs. The application is not limited to the semiconductor lithography field as it is expected to be applied in various manufacturing processes such as MEMS, micro-optics, and magnetic storage elements. This exhibit area will introduce technologies and emerging trends related to nanoimprint lithography. - 3D Packaging – As electronic devices have become smaller and lighter, semiconductors have also become smaller and thinner. This exhibit area introduces 3D packages, the technology that stacks LSI chips vertically to overcome space and resolution limitations. As different LSI chips and MEMS can be integrated to form a multifunction LSI, expectations are high on this technology.

EXPOSITIONS ON THE FOLLOWING TOPICS: - Metallurgy and Casting - Metalworking - Mechanical engineering - Modern industrial enterprise - Autoprom / ICTA - High Technologies. Innovations. Investments (Hi-Tech)